by TES International
Modules and Specifications
Platforms supported includes Windows XP, Vista, 7 but the software will work on Apple computers with a windows emulator.
ElectroFlo: An electronics cooling software package designed for high power-density applications. It is used for the thermal analysis of electrical components and systems. It combines the power of coupled thermal/electrical analysis with CFD and Radiation with a user-friendly graphical interface to provide solutions for complex problems. The software can be used in any electronics application from component-level and printed circuit board analysis, all the way up to the system level. It is particularly useful for analyzing high current applications.
All modules of ElectroFlo are included in the APA-enabled version.
In addition to ElectroFlo, TES also has included their software ThermoFlo within the APA.